제품에 대한 구입문의 또는 자세한 정보를 원하시는 분은 제품문의를 클릭하시고 내용을 입력해 주시면 빠른 시간 내에 답변드리도록 하겠습니다.

CMP : Si, GaAs, Poly-Si, SiO2, Metal( Au, Cu, Ni, Sus, Al etc. ),
          Polymer( PR, PMMA, PC, PT etc. ), Ceramic

Si, GaAs, Glass, Quartz, SOI, SOG, Metal, Polymer :  
  Thickness : 0.1 ~ 20mm
  Tolerance : ±10um
  Chipping  : < 50um

Diameter : 2" ~ 8"

Method : CZ, FZ

Grade : Prime, Test, Dummy

Type/Dopant : P(Boron), N (Phos, Antimony)

Orientation : <100>, <111>, <110>

Resistivity : 0.001 ~ 100,000 Ohm•cm

Min. Thickness & Tolerance 

2"

3"

4"

5"

6"

50um ±1um

50um ±1um

50um ±1um

90um ±1.5um

100um ±2um

Max Thickness : 10t

TTV : 2" ~ 5"(+/- 1um), 6"(+/- 2um) , 8"( +/- 4um)

Surface : One Side Polished, Double Side Polished

Diameter : 2" ~ 12"

Square : 5mm ~ 700mm

Material : Sodalime, Corning7740, Corning1737, Boro33, B270, ITO Glass Etc.

Min. Thickness & Tolerance 

2"

3"

4"

5"

6"

50um ±1um

50um ±1um

50um ±1um

90um ±1.5um

100um ±2um

Max Thickness : 10t

TTV : 2" ~ 5"( +/- 1um ),   6"( +/- 2um ),   8"( +/- 3um )

Surface : One Side Polishing, Double Side Polishing

Diameter : 2" ~ 8"

Square : 5mm ~ 150mm

Material : Fused Quartz, Fused Silica

Min. Thickness & Tolerance 

2"

3"

4"

5"

6"

50um ±1um

50um ±1um

50um ±1um

50um ±1.5um

100um ±2um

Max Thickness : 10t

TTV : 2" ~ 5"( +/- 1um ),   6" ( +/- 2um )

Surface : One Side Polishing, Double Side Polishing

특수 wafer :
SOI wafer, SOG Wafer(Si On Glass), GOG Wafer(Glass On Glass), SIMOX wafer, GaAs wafer, HRS wafer, Sapphire wafer.

Hole 가공 service : Sanding, Drilling, Laser

Jig 제작 : Ceramic, Graphite, Sapphire Jig 제작

대면적 Si, glass, quartz, Metal 가공 및 Polishing service

Thin Film Process Service :
각종 Metal 증착, SiO2, Si3N4, Pattern wafer 제작


 

CMP Service

Dicing / Slicing Service

Si Wafer

Glass Wafer


Quartz Wafer


 

특수 Wafer 및 기타 가공 Service