CMP Service

Dicing/Slicing Service

Si Wafer

Glass Wafer

Quartz Wafer

특수 Wafer 및 기타 가공 Service


 

택배주소: 동일테크노타운 C동 3209호

 

택배발송시 주소 확인 부탁드립니다.

 

주식회사디에스세미콘으로 사명이 변경되었습니다.

 

Dicing/Slicing Saws

Back-end & Assembly System

Microscope & Metrology

Others

Wanted Used Equipment
[Semi Automatic Dicing Saw] DAD381
[Semi Automatic Dicing Saw] DAD561
[Wire Bonder] K&S1488 Plus
[Automatic Dicing Saw] DAD 320
[Automatic Dicing Saw] DAD 521
[Automatic Dicing Saw] DAD 560
[Microscope - Leica High Power Set] INM 20
[Automatic Dicing Saw] DAD 640
[Fully Automatic Dicing Saw] DFD 651
[Fully Automatic Dicing Saw] DFD641
[Fully Automatic Dicing Saw] DFD 640
[Semi Automatic Dicing Saw] ADM6D