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¡ß
PRODUCT BENEFITS:
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Zero kerf loss allows higher die density on the wafer
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Increased production rates
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Chip free results
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Less residual stress
|
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No toxic water discharge
|
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No D.I. water costs
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More real estate; narrower street widths
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¡ß
PRODUCT FEATURES:
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Automatic
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Capable of complete, automatic scribing and breaking
of many substrate materials
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Cost effective
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- System integration allows easy hook-up and transport
- Superior yield and improved efficiency
- Reduced production time
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Environmental
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No DI or toxic waste water
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Versatile
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- Fully programmable for all scribing and breaking
parameters, including TrueAngle¢â
diamond tool positioning
- Infinitely programmable with Pentium¢â powered Windows¢â
interface
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Easy
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Few operator adjustments are required when changing
between wafer types
|
| ¡ß
SPECIFICATIONS:
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Wafer Size:
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150 mm max. (6 inch max.)
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Minimum Wafer Index:
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5 um with Std. Encoders; 1 um with Optional Hi-Res.
Encoders
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Maximum Wafer Index:
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150 mm
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Break Method:
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Patented impulse bar
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Vision System:
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Digital Hires BW/Color Camera; 17" Color Monitor;
Pattern Recognition System for Auto Alignment, Edge
Detection, and Auto Step-Correction
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Programmable:
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Scribe Tool Life; Scribe Angle; Scribe
Approach Speed; Scribe Force; Scribe Speed
Scribe Extension; Break Force; Multiple Die
Size; Fiducial Image Storage; Wafer Type and Profile;
Multiple Wafer Profile Storage. (Profiles programmable
in metric or imperial units.)
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Wafer Mounting:
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Std: Metal Saw Frames (Max 6" wafers - FF105/DY-NFR-007
and FF108/DY-WFR-001; Max 4" wafers - 6" hoops
and 7" hoops)
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Substrates:
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GaAs, LiNbO3, Glass, InP, GaP, Silicon, Quartz
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